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  december 2007 rev 2 1/10 10 SMM4F high junction temperature transil? features typical peak pulse power: ? 400 w (10/1000 s) ? 2.4 kw (8/20 s) stand off voltage range: from 5 v to 33 v unidirectional types low leakage current: ? 0.2 a at 25 c ? 1 a at 85 c operating t j max: 175 c jedec registered package outline rohs package halogen free molding compound complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g-method 3015-7: class3 ? 25 kv (human body model) description the SMM4F transil series has been designed to protect sensitive equipment against electro-static discharges according to iec 61000-4-2, mil std 883 method 3015, and electrical over stress such as iec 61000-4-4 and 5. they are generally for surges below 400 w 10/1000 s. this planar technology ma kes it compatible with high-end equipment and smps where low leakage current and high junction temperature are required to provide reli ability and stability over time. their low clamping voltages provide a better safety margin to protect sensitive circuits with extended life time expectancy. packaged in stmite flat, this minimizes pcb space consumption (footprint in accordance with ipc 7531 standard). tm: transil is a trademark of stmicroelectronics k a stmite flat (do222-aa) www.st.com
characteristics SMM4F 2/10 1 characteristics table 1. absolute ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage (iec 61000-4-2 contact discharge) 30 kv p pp peak pulse power dissipation (1) 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. t j initial = t amb 400 w p power dissipation on infinite heatsink t amb = 125 c 2.5 w i fsm non repetitive surge peak forward current for unidirectional types t p = 10 ms t j initial = t amb 30 a t stg storage temperature range -65 to +175 c t j operating junction temperature range -55 to +175 c t l maximum lead temperature for soldering during 10 s 260 c table 2. thermal resistances symbol parameter value unit r th(j-l) junction to leads 20 c/w r th(j-a) junction to ambient on pcb with recommended pad layout 250 table 3. electrical characteristics - parameter definitions (t amb = 25 c) symbol parameter v rm stand-off voltage v br breakdown voltage i r breakdown current v cl clamping voltage i rm leakage current @ v rm i pp peak pulse current t voltage temperature coefficient v f forward voltage drop r d dynamic resistance v cl v br v rm i rm i r i pp v i i f v f v cl v br v rm i rm i r i pp v i i f v f
SMM4F characteristics 3/10 figure 1. definition of i pp pulse table 4. electrical characteristics - parameter values (t amb = 25 c) type i rm max@v rm v br @i r (1) v cl @i pp 10/1000 s r d (2) 10/1000 s v cl @i pp 8/20 s r d (2) 8/20 s t (3) 25 c 85 c min typ max max max max a v v ma v a va 10-4/c SMM4F5.0a 10 50 5.0 6.46 6.80 7.14 10 9.2 43.5 0.047 13.4 174 0.04 5.7 SMM4F6.0a 10 50 6.0 6.65 7.00 7.35 10 10.3 38.8 0.076 13.7 170 0.04 5.9 SMM4F6.5a 10 50 6.5 7.13 7.50 7.88 10 11.2 37.5 0.093 14.5 160 0.04 6.1 SMM4F8.5a 10 50 8.5 9.5 10.0 10.5 1 14.4 27.7 0.141 19.5 124 0.07 7.3 SMM4F10a 0.2 1 10 11.4 12.0 12.6 1 17.0 23.5 0.187 21.7 106 0.09 7.8 SMM4F12a 0.2 1 12 13.3 14.0 14.7 1 19.9 20.1 0.259 25.3 91 0.12 8.3 SMM4F13a 0.2 1 13 14.3 15.0 15.8 1 21.5 18.6 0.309 27.2 85 0.13 8.4 SMM4F15a 0.2 1 15 17.1 18.0 18.9 1 24.4 16.4 0.335 32.5 71 0.19 8.8 SMM4F18a 0.2 1 18 20.9 22.0 23.1 1 29.2 14.0 0.436 39.3 59 0.27 9.2 SMM4F20a 0.2 1 20 22.8 24.0 25.2 1 32.4 12.0 0.600 42.8 54 0.33 9.4 SMM4F24a 0.2 1 24 26.6 28.01 29.4 1 38.9 9.5 1.00 50 46 0.47 9.6 SMM4F26a 0.2 1 26 28.5 30.0 31.5 1 42.1 9.0 1.18 53.5 43 0.51 9.7 SMM4F28a 0.2 1 28 31.4 33.0 34.7 1 45.4 8.0 1.34 59.0 39 0.62 9.8 SMM4F33a 0.2 1 33 37.1 39.0 41.0 1 53.3 7.0 1.76 69.7 33 0.87 10.0 1. pulse test: t p <50ms. 2. to calculate maximum clamping voltage at othe r surge currents, use the following formula v clmax = r d x i pp + v brmax 3. to calculate v br versus junction temperature, use the following formula: v br @ t j = v br @ 25 c x (1 + t x (t j - 25)) 100 50 %i pp t r t p 0 t repetitive peak pulse current tr = rise time (s) tp = pulse duration time (s)
characteristics SMM4F 4/10 figure 4. clamping voltage versus peak pulse current (exponential waveform, maximum values) figure 2. peak power dissipation versus initial junction temperature figure 3. peak pulse power versus exponential pulse duration (t j initial = 25 c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 25 50 75 100 125 150 175 200 p pp [t j initial] / p p p [t j init ial =25 c] t (c) j initial 0.1 1.0 10.0 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 t j initial = 25 c t (ms) p p (kw) pp 0 1 10 100 1000 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 t j initial=25 c SMM4F33a SMM4F24a SMM4F15a SMM4F5.0a tp = 8/20 s tp = 10/1000 s i pp (a) v cl (v)
SMM4F characteristics 5/10 figure 9. leakage current versus junction temperature (typical values) figure 5. junction capacitance versus reverse applied voltage (typical values) figure 6. peak forward voltage drop versus peak forward current (typical values) 10 100 1000 10000 1 10 100 f=1 mhz v osc =30 mv rms t j =25 c SMM4F5.0a SMM4F15a SMM4F24a SMM4F33a c(pf) v (v) r 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.0 0.5 1.0 1.5 2.0 2.5 3.0 t j =25 c t j =125 c i (a) fm v (v) fm figure 7. relative variation of thermal impedance junction to ambient versus pulse duration (printed ciruit board fr4, s cu = 1 cm 2 ) figure 8. thermal resistance junction to ambient versus copper surface under each lead (printed circuit board fr4, e cu = 35 m) 0.00 0.01 0.10 1.00 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 1.0e+03 on recommended pad layout z th(j-a) /r th(j-a) t (s) p 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 r th(j-a) (c/w) s (cm ) cu 2 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 25 50 75 100 125 150 175 v r =v rm v br 11.7v v br >11.7v t (c) j i (na) r
ordering information scheme SMM4F 6/10 2 ordering information scheme figure 10. ordering information scheme sm m 4f xx a - tr surface mount package surge rating m = stmite package 4f = 400 w in flat package stand off voltage example - 12 = 12 v type a = unidirectional packaging tr = tape and reel
SMM4F package information 7/10 3 package information case: jedec do-222aa molded plastic over planar junction terminals: solder plated, solderable per mil-std-750, method 2026 polarity: for unidirectional types the band indicates cathode. flammability: epoxy is rated ul94v-0 rohs package in order to meet environmental requirements, st (also) offers these devices in ecopack? packages. ecopack? packages are lead-free. the category of second level interconnect is marked on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 5. stmite flat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0.10 0.15 0.25 0.004 0.006 0.009 d 1.75 1.90 2.05 0.069 0.075 0.081 e 3.60 3.80 3.90 0.142 0.150 0.154 e1 2.80 2.95 3.10 0.110 0.116 0.122 l 0.50 0.55 0.80 0.020 0.022 0.031 l1 2.10 2.40 2.60 0.083 0.094 0.102 l2 0.45 0.60 0.75 0.018 0.024 0.030 l3 0.20 0.35 0.50 0.008 0.014 0.020 figure 11. stmite flat footprint dimensions figure 12. marking information e1 e c d b l3 a l l1 l2 b2 0.85 0.63 2.00 millimeters (inches) 4.13 0.95 1.95 0.65 0.65 (0.033) (0.079) (0.037) (0.077) (0.026) (0.163) (.025) (.026) y w w x x x xxx: marking y: year ww: week cathode bar ( unidirectional devices only )
package information SMM4F 8/10 table 6. marking type marking SMM4F5.0a-tr 4ua SMM4F6.0a-tr 4ub SMM4F6.5a-tr 4uc SMM4F8.5a-tr 4ud SMM4F10a-tr 4ue SMM4F12a-tr 4uf SMM4F13a-tr 4ug SMM4F15a-tr 4uh SMM4F18a-tr 4uj SMM4F20a-tr 4uk SMM4F24a-tr 4um SMM4F26a-tr 4un SMM4F28a-tr 4uo SMM4F33a-tr 4uq
SMM4F ordering information 9/10 4 ordering information 5 revision history table 7. ordering information order code (1) 1. xx indicates stand-off voltage marking package weight base qty delivery mode SMM4Fxxa-tr see table 6. stmite flat 16.7 mg 12000 tape and reel table 8. document revision history date revision changes 29-nov-2007 1 first issue. 19-dec-2007 2 updated i pp and r d parameters in columns 10 and 11 of ta b l e 4 .
SMM4F 10/10 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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